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Method of producing an optoelectronic component and component
US8994040B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8994040-B2 |
| Application number | US-201113992046-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 5, 2011 |
| Priority date | Dec 10, 2010 |
| Publication date | Mar 31, 2015 |
| Grant date | Mar 31, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
A method of producing an optoelectronic component including providing an epitaxially grown layer sequence on a growth substrate, which comprises a suitable layer for light emission; applying a metal layer to the epitaxially grown layer sequence; applying a molding support to the metal layer, the molding support including a support material with a first coefficient of thermal expansion and a fiber mesh with a second coefficient of thermal expansion functionally bonded to the support material; and detaching the growth substrate.
First claim
Opening claim text (preview).
The invention claimed is: 1. An arrangement of a plurality of optoelectronic components spaced apart from one another on a tape, the optoelectronic components comprising: an epitaxially grown layer sequence suitable for light emission in a main direction; a metal layer on a side of the epitaxially grown layer sequence remote from the main direction; and a molding support with a support material with a first coefficient of thermal expansion and with a fiber mesh with a second c…
Assignees
Inventors
Classifications
- H10H20/018Primary
Electricity · mapped topic
- H10H20/83Primary
Electricity · mapped topic
Electricity · mapped topic
- H10H20/815Primary
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8994040B2 cover?
- A method of producing an optoelectronic component including providing an epitaxially grown layer sequence on a growth substrate, which comprises a suitable layer for light emission; applying a metal layer to the epitaxially grown layer sequence; applying a molding support to the metal layer, the molding support including a support material with a first coefficient of thermal expansion and a fib…
- Who is the assignee on this patent?
- Lindberg Gudrun, Osram Opto Semiconductors Gmbh
- What technology area does this patent fall under?
- Primary CPC classification H10H20/018. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 31 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).