Method for manufacturing light-emitting device packages, light-emitting device package strip, and light-emitting device package
US-2018177019-A1 · Jun 21, 2018 · US
US8994039B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8994039-B2 |
| Application number | US-201013147824-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 25, 2010 |
| Priority date | Feb 4, 2009 |
| Publication date | Mar 31, 2015 |
| Grant date | Mar 31, 2015 |
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A lighting module may include a lighting band with a band-shaped flexible substrate, wherein at least one semiconductor light source is applied to a top side of the substrate, wherein the lighting module is faced with a protective layer such that at least one emission area of the at least one semiconductor light source is exposed thereby.
Opening claim text (preview).
The invention claimed is: 1. A lighting module, comprising: a lighting band with a band-shaped flexible substrate, wherein at least one semiconductor light source is applied to a top side of the substrate, wherein the lighting module is faced with a protective layer such that at least one emission area of the at least one semiconductor light source is exposed thereby, further comprising: an underlay for fixing a rear side of the lighting band, wherein the underlay is aroun…
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