Selective cuts to remove predicted interconnect bulging regions
US-2024419882-A1 · Dec 19, 2024 · US
US8994035B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8994035-B2 |
| Application number | US-201213682139-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 20, 2012 |
| Priority date | Nov 21, 2011 |
| Publication date | Mar 31, 2015 |
| Grant date | Mar 31, 2015 |
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A device including one or more low-conducting layers is provided. A low-conducting layer can be located below the channel and one or more attributes of the low-conducting layer can be configured based on a minimum target operating frequency of the device and a charge-discharge time of a trapped charge targeted for removal by the low-conducting layer or a maximum interfering frequency targeted for suppression using the low-conducting layer. For example, a product of the lateral resistance and a capacitance between the low-conducting layer and the channel can be configured to be larger than an inverse of the minimum target operating frequency and the product can be smaller than at least one of: the charge-discharge time or an inverse of the maximum interfering frequency.
Opening claim text (preview).
What is claimed is: 1. A device comprising: a semiconductor structure including a channel; a set of contacts to the channel; and a set of buried low-conducting layers located below the channel in the semiconductor structure, wherein, for each buried low-conducting layer in the set of buried low-conducting layers, a product of a lateral resistance of the buried low-conducting layer and a capacitance between the buried low-conducting layer and the channel is larger than an inver…
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