Rapid Thermal Processing System With Cooling System
US-2024379390-A1 · Nov 14, 2024 · US
Top wafer rotation and support
US8993933B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8993933-B2 |
| Application number | US-201313749550-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 24, 2013 |
| Priority date | Jan 26, 2012 |
| Publication date | Mar 31, 2015 |
| Grant date | Mar 31, 2015 |
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Abstract
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Embodiments of the present invention provide thermal processing chambers including a drive mechanism and a heating assembly disposed on opposite sides of a substrate support assembly. Particularly, the heating assembly is disposed below the substrate support assembly to process a substrate with a device side facing up and the drive mechanism is disposed above the substrate assembly.
First claim
Opening claim text (preview).
What is claimed is: 1. An apparatus for thermal processing a substrate, comprising: a chamber body defining a processing volume; a heating assembly disposed under the processing volume, wherein the heating assembly comprises a plurality of radiant heating sources directing radiant energy toward the processing volume; a substrate support assembly operable to position a substrate over the heating assembly in the processing volume; and a drive mechanism operable to rotate the s…
Assignees
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Classifications
Electricity · mapped topic
Electricity · mapped topic
- H10P72/0436Primary
Electricity · mapped topic
- H10P72/7618Primary
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8993933B2 cover?
- Embodiments of the present invention provide thermal processing chambers including a drive mechanism and a heating assembly disposed on opposite sides of a substrate support assembly. Particularly, the heating assembly is disposed below the substrate support assembly to process a substrate with a device side facing up and the drive mechanism is disposed above the substrate assembly.
- Who is the assignee on this patent?
- Applied Materials Inc
- What technology area does this patent fall under?
- Primary CPC classification H10P72/0436. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 31 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).