Spot-welding method and spot-welding device

US8993918B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8993918-B2
Application numberUS-201113137600-A
CountryUS
Kind codeB2
Filing dateAug 29, 2011
Priority dateSep 8, 2010
Publication dateMar 31, 2015
Grant dateMar 31, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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Abstract

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When spot-welding a workpiece including a thin plate, a first thick plate, and a second thick plate, the workpiece is clamped by a fixed electrode in contact with the second thick plate, a movable electrode in contact with the thin plate, and control-pressure applying unit set adjacent to the movable electrode and in contact with the thin plate. Pressure is applied to the second thick plate by the fixed electrode, and pressure and control pressure are respectively applied by the movable electrode and the control-pressure applying unit to the thin plate. The pressure from the fixed electrode is controlled to be smaller than the pressure from the movable electrode. The current density between the thin plate and the first thick plate increases.

First claim

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What is claimed is: 1. A spot-welding device for spot-welding a workpiece that includes a thin plate, a first thick plate, and a second thick plate that are sequentially stacked, the first thick plate and the second thick plate being thicker than the thin plate, the spot-welding device comprising: a base; a first welding electrode configured to face the second thick plate; a second welding electrode that is coaxially aligned with the first welding electrode and configured to f…

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What does patent US8993918B2 cover?
When spot-welding a workpiece including a thin plate, a first thick plate, and a second thick plate, the workpiece is clamped by a fixed electrode in contact with the second thick plate, a movable electrode in contact with the thin plate, and control-pressure applying unit set adjacent to the movable electrode and in contact with the thin plate. Pressure is applied to the second thick plate by …
Who is the assignee on this patent?
Sakai Kensuke, Kimura Keigo, Fuji Heavy Ind Ltd
What technology area does this patent fall under?
Primary CPC classification B23K11/115. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Mar 31 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).