Package component
US-2024215150-A1 · Jun 27, 2024 · US
Printed wiring board and method for manufacturing the same
US8993894B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8993894-B2 |
| Application number | US-201213424491-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 20, 2012 |
| Priority date | Mar 30, 2011 |
| Publication date | Mar 31, 2015 |
| Grant date | Mar 31, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
A printed wiring board includes a core substrate having first and second surfaces, a first conductor formed on the first surface of the substrate, a second conductor formed on the second surface of the substrate, a first through-hole conductor formed through the substrate and connecting the first and second conductors, and a second through-hole conductor formed through the substrate and connecting the first and second conductors. The second through-hole conductor has a diameter which is greater than a diameter of the first through-hole conductor, the first through-hole conductor has a roughened inner wall forming an interior space, the second through-hole conductor has a roughened inner wall forming an interior space, and the roughened inner wall of the first through-hole conductor has an arithmetic average roughness which is set lower than an arithmetic average roughness of the roughened inner wall of the second through-hole conductor.
First claim
Opening claim text (preview).
What is claimed is: 1. A printed wiring board, comprising: a core substrate having a first surface and a second surface on an opposite side of the first surface of the core substrate; a first conductor formed on the first surface of the core substrate; a second conductor formed on the second surface of the core substrate; a first through-hole conductor formed through the core substrate and connecting the first conductor and the second conductor; and a second through-hole c…
Assignees
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Classifications
Electricity · mapped topic
Electricity · mapped topic
- H05K3/427Primary
Electricity · mapped topic
Electricity · mapped topic
Cross-Sectional Technologies · mapped topic
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Frequently asked questions
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- What does patent US8993894B2 cover?
- A printed wiring board includes a core substrate having first and second surfaces, a first conductor formed on the first surface of the substrate, a second conductor formed on the second surface of the substrate, a first through-hole conductor formed through the substrate and connecting the first and second conductors, and a second through-hole conductor formed through the substrate and connect…
- Who is the assignee on this patent?
- Kawai Hideyuki, Takenaka Yoshinori, Ibiden Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H05K3/427. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 31 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).