Wiring board and method of manufacturing the wiring board

US8993892B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8993892-B2
Application numberUS-201213353527-A
CountryUS
Kind codeB2
Filing dateJan 19, 2012
Priority dateJan 24, 2011
Publication dateMar 31, 2015
Grant dateMar 31, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A wiring board includes: a substrate; first connection electrode portions which are disposed on a surface of the substrate and which are to be connected to individual-electrode connection terminals of an actuator via first bumps; first wires having electrical continuity with the first connection electrode portions; a second connecting electrode portion which is disposed on the surface of the substrate and which is to be connected to the a common-electrode connection terminal of the actuator via a second bump; and a second wire having electrical continuity with the second connection electrode portion. The second connecting electrode portion is located in an edge portion of the substrate. The second wire has a conducive-material absent portion that is located between an edge of the substrate and the second connecting electrode portion.

First claim

Opening claim text (preview).

What is claimed is: 1. A wiring board, which is to be connected to a plurality of individual-electrode connection terminals and at least one common-electrode connection terminal that are disposed on a surface of an actuator having a plurality of individual electrodes and at least one common electrode, the plurality of individual-electrode connection terminals being provided for the respective individual electrodes, and the at least one common-electrode connection terminal being pro…

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What does patent US8993892B2 cover?
A wiring board includes: a substrate; first connection electrode portions which are disposed on a surface of the substrate and which are to be connected to individual-electrode connection terminals of an actuator via first bumps; first wires having electrical continuity with the first connection electrode portions; a second connecting electrode portion which is disposed on the surface of the su…
Who is the assignee on this patent?
Yamashita Toru, Brother Ind Ltd
What technology area does this patent fall under?
Primary CPC classification H05K1/118. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 31 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).