Process tools and methods of forming devices using process tools

Patent metadata

Field	Value
Publication number	US-8993422-B2
Application number	US-201213670402-A
Country	US
Kind code	B2
Filing date	Nov 6, 2012
Priority date	Nov 6, 2012
Publication date	Mar 31, 2015
Grant date	Mar 31, 2015

Abstract

In accordance with an embodiment of the present invention, a process tool includes a chuck configured to hold a substrate. The chuck is disposed in a chamber. The process tool further includes a shielding unit with a central opening. The shielding unit is disposed in the chamber over the chuck.

First claim

What is claimed is:

1. A method of forming a device, the method comprising:
placing a first substrate over a chuck of a chamber;
positioning a shield between a plasma source and the chuck, the shield covering a first peripheral region of the chuck, wherein the shield includes a central opening exposing a central region of the chuck;
adjusting a diameter of the central opening to a first opening size; and
after adjusting the diameter of the central opening to the first openin…

Assignees

• Infineon Technologies Ag

Inventors

• Engelhardt Manfred

Classifications

• H10P50/242

  Electricity · mapped topic

• H01J2237/3343

  Electricity · mapped topic

• H01J2237/3322

  Electricity · mapped topic

• H01J37/32715

  Electricity · mapped topic

• H01J37/32532

  Electricity · mapped topic