Display apparatus and method of manufacturing the same
US-2024419215-A1 · Dec 19, 2024 · US
US8993409B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8993409-B2 |
| Application number | US-201213414944-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 8, 2012 |
| Priority date | Dec 9, 2011 |
| Publication date | Mar 31, 2015 |
| Grant date | Mar 31, 2015 |
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A method for fabricating air media layer within the semiconductor optical device is provided. The step of method includes a substrate is provided, a GaN thin film is formed on the substrate, a sacrificial layer is formed on the GaN thin film, and a nitride-containing semiconductor layer is formed on the sacrificial layer. The semiconductor optical device is immersed with an acidic solution to remove the portion of sacrificial layer to form an air media layer around the residual sacrificial layer.
Opening claim text (preview).
What is claimed is: 1. A method for fabricating an air media layer within a semiconductor optical device providing a substrate, forming a GaN thin film, forming a sacrificial layer, forming the GaN thin film layer on the sacrificial layer and etching to form an air media layer, comprising: providing a substrate; forming a nitride-containing semiconductor on the substrate by using a metal-organic chemical vapor deposition method; forming a sacrificial layer on the nitride-conta…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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