Thin-film transistor and method for manufacturing thin-film transistor

US8993383B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8993383-B2
Application numberUS-201314130939-A
CountryUS
Kind codeB2
Filing dateMay 29, 2013
Priority dateJun 8, 2012
Publication dateMar 31, 2015
Grant dateMar 31, 2015

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A method for manufacturing a thin-film transistor, includes: preparing a substrate; forming a gate electrode above the substrate; forming a gate insulating layer above the gate electrode; forming a semiconductor film above the gate insulating layer; forming, above the semiconductor film, a protective layer comprising an organic material; forming a source electrode and a drain electrode above the protective layer; forming a semiconductor layer patterned, by performing dry etching on the semiconductor film; removing at least a portion of a region of an altered layer, the region contacting the semiconductor layer, the altered layer being a surface layer of the protective layer that is altered by the dry etching; and forming a passivation layer having a major component identical to a major component of the protective layer so as to contact the semiconductor layer in a region in which the altered layer has been removed.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for manufacturing a thin-film transistor, the method comprising: preparing a substrate; forming a gate electrode above the substrate; forming a gate insulating layer above the gate electrode; forming a semiconductor film above the gate insulating layer; forming, above the semiconductor film, an etch-stopper layer comprising an organic material; forming a source electrode and a drain electrode that are opposed to each other, each of t…

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What does patent US8993383B2 cover?
A method for manufacturing a thin-film transistor, includes: preparing a substrate; forming a gate electrode above the substrate; forming a gate insulating layer above the gate electrode; forming a semiconductor film above the gate insulating layer; forming, above the semiconductor film, a protective layer comprising an organic material; forming a source electrode and a drain electrode above th…
Who is the assignee on this patent?
Panasonic Corp
What technology area does this patent fall under?
Primary CPC classification H10D86/451. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 31 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).