Display device and method for fabricating the same
US-2024363819-A1 · Oct 31, 2024 · US
US8993383B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8993383-B2 |
| Application number | US-201314130939-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 29, 2013 |
| Priority date | Jun 8, 2012 |
| Publication date | Mar 31, 2015 |
| Grant date | Mar 31, 2015 |
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A method for manufacturing a thin-film transistor, includes: preparing a substrate; forming a gate electrode above the substrate; forming a gate insulating layer above the gate electrode; forming a semiconductor film above the gate insulating layer; forming, above the semiconductor film, a protective layer comprising an organic material; forming a source electrode and a drain electrode above the protective layer; forming a semiconductor layer patterned, by performing dry etching on the semiconductor film; removing at least a portion of a region of an altered layer, the region contacting the semiconductor layer, the altered layer being a surface layer of the protective layer that is altered by the dry etching; and forming a passivation layer having a major component identical to a major component of the protective layer so as to contact the semiconductor layer in a region in which the altered layer has been removed.
Opening claim text (preview).
The invention claimed is: 1. A method for manufacturing a thin-film transistor, the method comprising: preparing a substrate; forming a gate electrode above the substrate; forming a gate insulating layer above the gate electrode; forming a semiconductor film above the gate insulating layer; forming, above the semiconductor film, an etch-stopper layer comprising an organic material; forming a source electrode and a drain electrode that are opposed to each other, each of t…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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