Method for manufacturing liquid discharge head

US8993357B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8993357-B2
Application numberUS-201414198356-A
CountryUS
Kind codeB2
Filing dateMar 5, 2014
Priority dateMar 6, 2013
Publication dateMar 31, 2015
Grant dateMar 31, 2015

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A method for manufacturing a liquid discharge includes a process of forming a plurality of blind holes extending from a first surface of the silicon substrate toward a second surface which is a surface opposite to the first surface in the silicon substrate and a process of subjecting the silicon substrate in which the plurality of blind holes are formed to anisotropic etching from the first surface to form a liquid supply port in the silicon substrate, in which, in the process of forming the liquid supply port, the silicon in a region sandwiched by the plurality of blind holes when the silicon substrate is seen from the second surface side is left without being removed by the anisotropic etching to use the left silicon as a beam.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for manufacturing a liquid discharge head having a silicon substrate in which a beam is formed in a liquid supply port, the method comprising: forming a first liquid supply port in a silicon substrate; forming a plurality of blind holes extending from a first surface of the silicon substrate toward a side of a second surface which is a surface opposite to the first surface in the silicon substrate from a bottom surface of the first liquid supply p…

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What does patent US8993357B2 cover?
A method for manufacturing a liquid discharge includes a process of forming a plurality of blind holes extending from a first surface of the silicon substrate toward a second surface which is a surface opposite to the first surface in the silicon substrate and a process of subjecting the silicon substrate in which the plurality of blind holes are formed to anisotropic etching from the first sur…
Who is the assignee on this patent?
Canon Kk
What technology area does this patent fall under?
Primary CPC classification B41J2/1628. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Mar 31 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).