Pattern forming process

US8993222B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8993222-B2
Application numberUS-201414156609-A
CountryUS
Kind codeB2
Filing dateJan 16, 2014
Priority dateFeb 14, 2013
Publication dateMar 31, 2015
Grant dateMar 31, 2015

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A pattern is formed by coating a first resist composition comprising a resin comprising recurring units having an acid labile group so that it may turn insoluble in organic solvent upon elimination of the acid labile group, a photoacid generator, and a first organic solvent, onto a processable substrate, prebaking, exposing, PEB, and developing in an organic solvent developer to form a first negative pattern; heating the negative pattern to render it resistant to a second organic solvent used in a second resist composition; coating the second resist composition, prebaking, exposing, PEB, and developing in an organic solvent developer to form a second negative pattern. The first and second negative patterns are simultaneously formed.

First claim

Opening claim text (preview).

The invention claimed is: 1. A pattern forming process comprising the steps of: coating a first chemically amplified resist composition onto a processable substrate, said first resist composition comprising a resin comprising recurring units having 7-oxanorbornane ring and recurring units having an acid labile group which is eliminatable with acid so that it may turn insoluble in an organic solvent developer as a result of the acid labile group being eliminated, a photoacid genera…

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What does patent US8993222B2 cover?
A pattern is formed by coating a first resist composition comprising a resin comprising recurring units having an acid labile group so that it may turn insoluble in organic solvent upon elimination of the acid labile group, a photoacid generator, and a first organic solvent, onto a processable substrate, prebaking, exposing, PEB, and developing in an organic solvent developer to form a first ne…
Who is the assignee on this patent?
Shinetsu Chemical Co
What technology area does this patent fall under?
Primary CPC classification G03F7/2024. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Mar 31 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).