Package architecture utilizing wafer to wafer bonding
US-2024379487-A1 · Nov 14, 2024 · US
US8993121B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8993121-B2 |
| Application number | US-201013580082-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 27, 2010 |
| Priority date | Feb 19, 2010 |
| Publication date | Mar 31, 2015 |
| Grant date | Mar 31, 2015 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
There is provided a metal laminated structure in which a first metal layer containing tungsten is provided on a first surface of a second metal layer containing copper and a third metal layer containing tungsten is provided on a second surface of the second metal layer opposite to the first surface, and the first metal layer contains crystal grains of tungsten in a form of a columnar crystal extending in a direction perpendicular to the first surface of the second metal layer and the third metal layer contains crystal grains of tungsten in a form of a columnar crystal extending in a direction perpendicular to the second surface of the second metal layer, and a method for producing the metal laminated structure.
Opening claim text (preview).
The invention claimed is: 1. A metal laminated structure comprising a first metal layer containing tungsten, a second metal layer containing copper, and a third metal layer containing tungsten, said first metal layer being provided on a first surface of said second metal layer, said third metal layer being provided on a second surface of said second metal layer opposite to said first surface, said first metal layer containing crystal grains of said tungsten in a form of a colu…
Electricity · mapped topic
Electricity · mapped topic
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
Electricity · mapped topic
Related publications grouped by family.
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Answers are generated from the same data shown on this page.