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Substrate for superconducting compound and method for manufacturing the substrate
US8993064B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8993064-B2 |
| Application number | US-201013510406-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 12, 2010 |
| Priority date | Nov 20, 2009 |
| Publication date | Mar 31, 2015 |
| Grant date | Mar 31, 2015 |
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Abstract
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Provided are a substrate for a superconducting compound and a method for manufacturing the substrate which can realize the excellent adhesive strength simultaneously with high orientation of copper. An absorbed material on a surface of a copper foil to which rolling is applied at a draft of 90% or more is removed by applying sputter etching to the surface of the copper foil, sputter etching is applied to a nonmagnetic metal sheet, the copper foil and the metal sheet are bonded to each other by applying a pressure to the copper foil and the metal sheet using reduction rolls, crystals of the copper in the copper foil are oriented by heating a laminated body formed by such bonding, copper is diffused into the metal sheet by heating with a copper diffusion distance of 10 nm or more, and a protective layer is laminated to a surface of the copper foil of the laminated body.
First claim
Opening claim text (preview).
The invention claimed is: 1. A method for manufacturing a substrate for a superconducting compound, the method comprising the steps of: removing an absorbed material on a surface of a cold-rolled copper foil by applying sputter etching to the surface of the cold-rolled copper foil, the cold-rolled copper foil having an absorbed material on the surface thereof and having been cold-rolled at a draft of 90% or more; applying sputter etching to a surface of a nonmagnetic metal sheet…
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- C22C9/00Primary
Chemistry & Metallurgy · mapped topic
Operations & Transport · mapped topic
Chemistry & Metallurgy · mapped topic
Cross-Sectional Technologies · mapped topic
Chemistry & Metallurgy · mapped topic
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Frequently asked questions
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- What does patent US8993064B2 cover?
- Provided are a substrate for a superconducting compound and a method for manufacturing the substrate which can realize the excellent adhesive strength simultaneously with high orientation of copper. An absorbed material on a surface of a copper foil to which rolling is applied at a draft of 90% or more is removed by applying sputter etching to the surface of the copper foil, sputter etching is …
- Who is the assignee on this patent?
- Okayama Hironao, Nanbu Kouji, Kaneko Akira, and 7 more
- What technology area does this patent fall under?
- Primary CPC classification C22C9/00. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Mar 31 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).