Method for manufacturing mold

Patent metadata

Field	Value
Publication number	US-8992789-B2
Application number	US-201313780769-A
Country	US
Kind code	B2
Filing date	Feb 28, 2013
Priority date	Mar 16, 2012
Publication date	Mar 31, 2015
Grant date	Mar 31, 2015

Abstract

According to one embodiment, a method is disclosed for manufacturing a mold. The method can include forming a second major surface receded from a first major surface by irradiating a portion of the first major surface with a charged beam to etch a base material having the first major surface. The method can include forming a mask pattern on the first major surface and the second major surface. In addition, the method can include forming a first pattern on the first major surface and a second pattern on the second major surface by etching the base material through the mask pattern.

First claim

What is claimed is:

1. A method for manufacturing a mold, comprising:
forming a second major surface receded from a first major surface by irradiating a portion of the first major surface with a charged beam to etch a base material having the first major surface, an upper part of another portion of the first major surface being shielded by a mask spaced from the first major surface while irradiating the portion of the first major surface;
forming a mask pattern on the first majo…

Assignees

• Toshiba Kk

Inventors

• Suzuki Masato
• Nakasugi Tetsuro

Classifications

• B82Y10/00

  Operations & Transport · mapped topic

• G03F7/0002 Primary

  Physics · mapped topic

• G03F7/16

  Physics · mapped topic

• B29C33/3842 Primary

  Operations & Transport · mapped topic

• G03F9/7084

  Physics · mapped topic