Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
US8992045B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8992045-B2 |
| Application number | US-201113188916-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 22, 2011 |
| Priority date | Jul 22, 2011 |
| Publication date | Mar 31, 2015 |
| Grant date | Mar 31, 2015 |
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Official abstract text for this publication.
Certain example embodiments relate to improved lighting systems and/or methods of making the same. In certain example embodiments, a lighting system includes a glass substrate with one or more apertures. An LED or other light source is disposed at one end of the aperture such that light from the LED directed through the aperture of the glass substrate exits the opposite end of the aperture. Inner surfaces of the aperture have a mirroring material such as silver to reflect the emitted light from the LED. In certain example embodiments, a remote phosphor article or layer is disposed opposite the LED at the other end of the aperture. In certain example embodiment, a lens is disposed in the aperture, between the remote phosphor article and the LED.
Opening claim text (preview).
What is claimed is: 1. A method of making a light fixture, the method comprising: forming a plurality of cavities in a glass substrate, the cavities each being tapered along a depth thereof so that each cavity increases in diameter or distance from a first end thereof to a second end thereof; disposing a reflective element on a surface of each of the cavities; disposing a lens entirely within each of the cavities; and locating a light emitting diode (LED) at or proximate to…
Mechanical Engineering · mapped topic
Mechanical Engineering · mapped topic
Mechanical Engineering · mapped topic
Mechanical Engineering · mapped topic
Mechanical Engineering · mapped topic
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