Methods and structures for forming and improving solder joint thickness and planarity control features for solar cells

US8991682B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8991682-B2
Application numberUS-201414162619-A
CountryUS
Kind codeB2
Filing dateJan 23, 2014
Priority dateSep 28, 2012
Publication dateMar 31, 2015
Grant dateMar 31, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for connecting a plurality of solar cells and an improved interconnect is disclosed. The method includes aligning an interconnect to a plurality of solar cells having solder pads, where the interconnect has a main body and tabs extending therefrom, and where each of the tabs has a downward depression, such that the tabs are positioned above the solder pads in between solar cells and pinning the interconnect against a work surface by pressing a hold down pin against the main body of the interconnect such that a lower surface of the interconnect tabs are maintained parallel to an upper surfaces of the solder pads, and such that the depression of each of the tabs flatly contacts the solder pads. The method can also include cantilevered tabs extending downwardly from the main body providing a controlled spring force between the tab lower surface and the solder pad upper surface.

First claim

Opening claim text (preview).

What is claimed is: 1. A solar power system comprising: a first solar cell; a second solar cell adjacent the first solar cell, each of the first and second solar cells having a plurality of solder pads; and an interconnect aligned with the first and second solar cells, the interconnect having a main body and a plurality of tabs extending from the main body, each tab having a downward depression extending towards the first solar cell or the second solar cell, wherein lower su…

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What does patent US8991682B2 cover?
A method for connecting a plurality of solar cells and an improved interconnect is disclosed. The method includes aligning an interconnect to a plurality of solar cells having solder pads, where the interconnect has a main body and tabs extending therefrom, and where each of the tabs has a downward depression, such that the tabs are positioned above the solder pads in between solar cells and pi…
Who is the assignee on this patent?
Sunpower Corp
What technology area does this patent fall under?
Primary CPC classification B23K1/0016. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Mar 31 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).