Solder piece, chip solder and method of fabricating solder piece

Patent metadata

Field	Value
Publication number	US-8991679-B2
Application number	US-201113501746-A
Country	US
Kind code	B2
Filing date	Sep 30, 2011
Priority date	Sep 30, 2011
Publication date	Mar 31, 2015
Grant date	Mar 31, 2015

Abstract

A solder piece that has a rectangular parallelepiped shape formed by a punching process. Any one of the four surfaces of the rectangular parallelepiped other than the surface on which the shear droop portion generated by the punching process is formed and a surface opposite to the surface on which the shear droop portion is formed is sucked surface.

First claim

The invention claimed is:

1. A chip solder which comprises:
a solder piece that has a rectangular parallelepiped shape with a first surface, a second surface opposite the first surface, a third surface, a fourth surface opposite the third surface, a fifth surface including a shear droop portion generated by the punching process, and a sixth surface, opposite the fifth surface, the solder piece being formed by punching the sixth surface, in a punching process along a longitudinal direction of the rectangular parallelepiped shaped solder piece, and wherein the first through fourth surfaces are sheared surfaces and planar, and wherein any one of the first through fourth surfaces is a vacuum pickup surface, but neither the fifth surface nor the sixth surface is a vacuum pickup surface, and wherein a distance between the fifth and sixth surfaces is greater than a distance between the first and second surfaces and is greater than a distance between the third and fourth surfaces, and wherein the sixth surface has an area that is smaller than an area of each of the first through fourth surfaces; and
a supply tape formed with an open cavity portion in which the solder piece is located, wherein the open cavity portion is rectangular and has a length that accommodates the distance between the fifth and sixth surfaces and has a width that is greater than the distance between the first and second surfaces, is greater than the distance between the third and fourth surfaces, and is smaller than the distance between the fifth and sixth surfaces, and wherein the solder piece is located in the open cavity portion with one of only the first through fourth surfaces exposed to be a vacuum pickup surface.

2. The chip solder according to claim 1 , wherein the distance between the third and fourth surfaces of the solder piece is greater than the distance between the first and second surfaces, the width of the open cavity portion accommodates the distance between the third and fourth surfaces, and the solder piece is located in the open cavity portion with the third surface exposed.

3. A method of manufacturing a chip solder comprising:
forming a solder piece by a punching process, whereby the solder piece is formed in a rectangular parallelepiped shape with a first surface, a second surface opposite the first surface, a third surface, a fourth surface opposite the third surface, a fifth surface on which a shear droop portion is formed by the punching process, and a sixth surface opposite the fifth surface, and wherein the first through fourth surfaces are sheared surfaces and planar and any one of only the first through fourth surfaces is a vacuum pickup surface, but neither the fifth surface nor the sixth surface is a vacuum pickup surface, and wherein a distance between the fifth and sixth surfaces is greater than a distance between the first and second surfaces and is greater than a distance between the third and fourth surfaces, and the sixth surface has an area that is smaller than an area of each of the first through fourth surfaces, and
providing a supply tape formed with an open cavity portion for receiving a solder piece, wherein the open cavity portion is rectangular and has a length sufficient to accommodate the distance between the fifth and sixth surfaces and has a width greater than the distance between the first and second surfaces, greater than the distance between the third and fourth surfaces, and smaller than the distance between the fifth and sixth surfaces, and
placing the solder piece in the open cavity portion of the supply tape with one of only the first through fourth surfaces exposed to be available for vacuum pickup.

Assignees

• Abe Masahiko
• Watanabe Koji
• Hideaki Takahashi
• Kanno Masahiko
• Ito Masaya
• Senju Metal Industry Co

Inventors

• Abe Masahiko
• Watanabe Koji
• Takahashi Hideaki
• Kanno Masahiko
• Ito Masaya

Classifications

• B23K35/325

  Ti as the principal constituent · CPC title

• H05K2203/082

  Suction, e.g. for holding solder balls or components · CPC title

• B23K1/0016

  Soldering of electronic components · CPC title

• B23K35/302

  Cu as the principal constituent · CPC title

• H05K2203/0415

  Small preforms other than balls, e.g. discs, cylinders or pillars · CPC title