Methods of forming semiconductor devices
US-2024387699-A1 · Nov 21, 2024 · US
Substrate cutting device and method
US8991673B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8991673-B2 |
| Application number | US-201113293772-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 10, 2011 |
| Priority date | Jan 3, 2002 |
| Publication date | Mar 31, 2015 |
| Grant date | Mar 31, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
An automatic cutting device is described for cutting an assembly. The assembly includes a material having a weakened zone therein that defines a useful layer and being attached to a source substrate. The cutting device includes a cutting mechanism and a holding and positioning mechanism operatively associated with the cutting mechanism. The holding and positioning mechanism positions the material so that the cutting mechanism detaches the layer from the source substrate along the weakened zone. The cutting device also includes a control mechanism for adjusting at least two different portions of the assembly during detachment of the layer to facilitate a more precise detachment.
First claim
Opening claim text (preview).
What is claimed is: 1. A method for automatically separating an assembly along a weakened zone therein, which method comprises: holding and positioning the assembly with at least two grippers, and completely separating the assembly by cutting the weakened zone partially but not fully along a cutting plane in combination with inducing strain in the weakened zone by moving at least one of the grippers relative to the other; wherein the movement of the grippers is controlled in c…
Assignees
Inventors
Classifications
Electricity · mapped topic
Electricity · mapped topic
- H10P90/1916Primary
Electricity · mapped topic
Electricity · mapped topic
- H01L21/76254Primary
Electricity · mapped topic
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- What does patent US8991673B2 cover?
- An automatic cutting device is described for cutting an assembly. The assembly includes a material having a weakened zone therein that defines a useful layer and being attached to a source substrate. The cutting device includes a cutting mechanism and a holding and positioning mechanism operatively associated with the cutting mechanism. The holding and positioning mechanism positions the materi…
- Who is the assignee on this patent?
- Rayssac Olivier, Letertre Fabrice, Soitec Silicon On Insulator
- What technology area does this patent fall under?
- Primary CPC classification H10P90/1916. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 31 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).