Method for inserting a wire into a contact pin with a wire insertion tool

US8991044B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8991044-B2
Application numberUS-201313956443-A
CountryUS
Kind codeB2
Filing dateAug 1, 2013
Priority dateApr 6, 2011
Publication dateMar 31, 2015
Grant dateMar 31, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for inserting a wire into a contact pin utilizes a wire insertion tool. The wire insertion tool includes a first division block having a first wire insertion guide ditch forming plane where a first wire insertion guide ditch has been formed, a second division block having a second wire insertion guide ditch forming plane where a second wire insertion guide ditch has been formed, and a division block positioning guide. When the first and second division blocks are fitted together by fitting the first and second wire insertion guide ditch forming planes, the first and second wire insertion guide ditches form a wire insertion guide hole. The division block positioning guide guides one of the blocks linearly to the other block such that these planes approach each other or separate from each other.

First claim

Opening claim text (preview).

What is claimed is: 1. A wire inserting method for a wire insertion tool, said wire insertion tool comprising: a first division block having a first wire insertion guide ditch forming plane on which a first wire insertion guide ditch has been formed; a second division block having a second wire insertion guide ditch forming plane on which a second wire insertion guide ditch has been formed; and a division block positioning guide configured to guide one of said first division b…

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What does patent US8991044B2 cover?
A method for inserting a wire into a contact pin utilizes a wire insertion tool. The wire insertion tool includes a first division block having a first wire insertion guide ditch forming plane where a first wire insertion guide ditch has been formed, a second division block having a second wire insertion guide ditch forming plane where a second wire insertion guide ditch has been formed, and a …
Who is the assignee on this patent?
Mitsubishi Heavy Ind Ltd
What technology area does this patent fall under?
Primary CPC classification H01R43/00. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 31 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).