Tracing support for interconnect fabric

US8990633B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8990633-B2
Application numberUS-42764609-A
CountryUS
Kind codeB2
Filing dateApr 21, 2009
Priority dateApr 21, 2009
Publication dateMar 24, 2015
Grant dateMar 24, 2015

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Abstract

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Complex on-chip interconnect fabrics, particularly those that include point-to-point interconnects and coherent routing networks, can present significant challenges for conventional trace techniques that may be applied in an effort to efficiently provide an external debugger with visibility into on-chip interconnect transactions. Embodiments described herein generate and supply separate in-circuit-trace messages including address messages and data messages, which are sent out (i.e., off-chip) to external debug tools generally without delay and coincident with the distinct, but related, trace events within address and data paths of the interconnect fabric. These separate message instances embed appropriate tag and mark values to allow the message instances to be post-processed and correlated by the external debug tools so as to reconstruct the transaction information for operations performed in the on-chip interconnect.

First claim

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What is claimed is: 1. A method of testing an integrated circuit chip, the method comprising: based on operations performed within an interconnect fabric located on-chip, receiving off-chip at least two separate streams of trace messages, the first stream including trace messages corresponding to a first transaction phase of respective ones of the operations and the second stream including trace messages corresponding to a second transaction phase of the respective operations; and…

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What does patent US8990633B2 cover?
Complex on-chip interconnect fabrics, particularly those that include point-to-point interconnects and coherent routing networks, can present significant challenges for conventional trace techniques that may be applied in an effort to efficiently provide an external debugger with visibility into on-chip interconnect transactions. Embodiments described herein generate and supply separate in-circ…
Who is the assignee on this patent?
Xu Zheng, Deshpande Sanjay, Snyder Michael, and 1 more
What technology area does this patent fall under?
Primary CPC classification G06F11/26. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Mar 24 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).