Semiconductor package with integrated interference shielding and method of manufacture thereof

Patent metadata

Field	Value
Publication number	US-8987889-B2
Application number	US-201414299895-A
Country	US
Kind code	B2
Filing date	Jun 9, 2014
Priority date	Jul 31, 2008
Publication date	Mar 24, 2015
Grant date	Mar 24, 2015

Abstract

An integrated electromagnetic interference (EMI) shield for a semiconductor module package. The integrated EMI shield includes a plurality of wirebond springs electrically connected between a ground plane in the substrate of the package and a conductive layer printed on the top of the package mold compound. The wirebond springs have a defined shape that causes a spring effect to provide contact electrical connection between the tops of the wirebond springs and the conductive layer. The wirebond springs can be positioned anywhere in the module package, around all or some of the devices included in the package, to create a complete EMI shield around those devices.

First claim

What is claimed is:

1. A packaged semiconductor module having an integrated electromagnetic interference shield comprising:
a substrate having a ground plane;
an electronic device mounted on a surface of the substrate;
a plurality of wirebond springs disposed about the electronic device and electrically coupled to the ground plane, each of the plurality of wirebond springs including a loop of wire having a ball bond disposed on the surface of the substrate, a zone of inflectio…

Assignees

• Skyworks Solutions Inc

Inventors

• Welch Patrick Lawrence
• Guo Yifan

Classifications

• H10W72/5522

  Electricity · mapped topic

• H10W42/267

  Electricity · mapped topic

• H10W42/276

  Electricity · mapped topic

• H10W74/00

  Electricity · mapped topic

• H10W90/754

  Electricity · mapped topic