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US-11879060-B2 · Jan 23, 2024 · US
Epoxy resin composition for sealing, and electronic component device
US8987355B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8987355-B2 |
| Application number | US-201213976538-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 26, 2012 |
| Priority date | Jan 28, 2011 |
| Publication date | Mar 24, 2015 |
| Grant date | Mar 24, 2015 |
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Abstract
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The present invention provides an epoxy resin composition for sealing that demonstrates favorable adhesion to a copper lead frame in which oxidation has progressed and has superior mold release and continuous moldability. The epoxy resin composition for sealing includes (A) an epoxy resin, (B) a phenolic resin-based curing agent, (C) an inorganic filler, and (D) a curing accelerator. The curing accelerator (D) has an average particle diameter of 10 μm or less, and the ratio of particles having a particle diameter in excess of 20 μm is 1% by weight or less. Also, the curing accelerator (D) includes at least one type of curing accelerator selected from the group consisting of a phosphobetaine compound having a specific structure; adduct of a phosphine compound having a specific structure, and quinone compound; and an adduct of a phosphonium compound having a specific structure, and a silane compound. An electronic component device in which an electronic component is sealed by a cured product of the aforementioned epoxy resin composition for sealing is provided.
First claim
Opening claim text (preview).
The invention claimed is: 1. An epoxy resin composition for sealing, comprising: (A) an epoxy resin, (B) a phenolic resin-based curing agent, (C) an inorganic filler, and (D) a curing accelerator, wherein the curing accelerator (D) has an average particle diameter of 10 μm or less, and the ratio of particles having a particle diameter in excess of 20 μm is 1% by weight or less, and the curing accelerator (D) comprises at least one type of curing accelerator selected from the gro…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8987355B2 cover?
- The present invention provides an epoxy resin composition for sealing that demonstrates favorable adhesion to a copper lead frame in which oxidation has progressed and has superior mold release and continuous moldability. The epoxy resin composition for sealing includes (A) an epoxy resin, (B) a phenolic resin-based curing agent, (C) an inorganic filler, and (D) a curing accelerator. The curing…
- Who is the assignee on this patent?
- YUZURIHA Yukiharu, Sumitomo Bakelite Co
- What technology area does this patent fall under?
- Primary CPC classification H10W74/476. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 24 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).