Quasi melt blow down system

US8985485B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8985485-B2
Application numberUS-201213547685-A
CountryUS
Kind codeB2
Filing dateJul 12, 2012
Priority dateOct 3, 2011
Publication dateMar 24, 2015
Grant dateMar 24, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A melt blown system for adding a fine fiber layer to a substrates includes a die assembly, a first channel in the die assembly for carrying a first fluid, a first cavity fluidically coupled to the first channel that is configured to collect the first fluid, a first orifice for carrying a second fluid through the die assembly which is fluidically coupled to a second orifice in the die assembly by at least one channel, a plurality of first nozzles in the die assembly that are fluidically coupled to the first orifice, a plurality of second nozzles in the die assembly that are fluidically coupled to the second orifices, and a plurality of third nozzles in the die assembly that are fluidically coupled to the first cavity.

First claim

Opening claim text (preview).

The invention claimed is: 1. A melt blown system including: a die assembly having a plurality of thin plates compressed together and secured between opposing end plates; a first channel in the die assembly for carrying a first fluid; a first cavity formed contiguously in one or more of the thin plates fluidically coupled to the first channel that is configured to collect the first fluid, the first cavity defining an accumulator cavity; an inlet channel formed contiguously in…

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What does patent US8985485B2 cover?
A melt blown system for adding a fine fiber layer to a substrates includes a die assembly, a first channel in the die assembly for carrying a first fluid, a first cavity fluidically coupled to the first channel that is configured to collect the first fluid, a first orifice for carrying a second fluid through the die assembly which is fluidically coupled to a second orifice in the die assembly b…
Who is the assignee on this patent?
Budai Michael B, Bolyard Jr Edward W, Illinois Tool Works
What technology area does this patent fall under?
Primary CPC classification B05C5/0245. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Mar 24 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).