Cooler with two substantially parallel flow chambers and three substantially parallel plates
US-2024003639-A1 · Jan 4, 2024 · US
Heat dissipation unit with mounting structure
US8985197B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8985197-B2 |
| Application number | US-201113226473-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 6, 2011 |
| Priority date | Aug 17, 2011 |
| Publication date | Mar 24, 2015 |
| Grant date | Mar 24, 2015 |
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Abstract
Official abstract text for this publication.
A heat dissipation unit with mounting structure includes a main body and a plurality of mounting elements. The main body internally defines a chamber, and includes a plurality of supports located in the chamber, a working fluid filled in the chamber, and at least one wick structure formed on inner wall surfaces of the chamber. The mounting elements are externally connected to one side of the main body at positions corresponding to the supports in the chamber, and respectively define an internally threaded coupling bore therein. With these arrangements, it is able to ensure the air-tightness of the chamber of the heat dissipation unit having the mounting elements provided thereon. Further, the mounting elements with internally threaded coupling bore also provide good locking effect for the heat dissipation unit to securely connect with other elements via the mounting elements.
First claim
Opening claim text (preview).
What is claimed is: 1. A heat dissipation unit with mounting structure, comprising: a main body internally defining a chamber, and including a plurality of discreet support elements provided and sealed in the chamber, a working fluid filled in the chamber, and at least one wick structure formed on inner wall surfaces of the chamber; and a plurality of mounting elements being externally connected to a first side of the main body at positions corresponding to the supports in the c…
Assignees
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Classifications
Electricity · mapped topic
Electricity · mapped topic
- F28F3/12Primary
Mechanical Engineering · mapped topic
Electricity · mapped topic
Mechanical Engineering · mapped topic
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Frequently asked questions
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- What does patent US8985197B2 cover?
- A heat dissipation unit with mounting structure includes a main body and a plurality of mounting elements. The main body internally defines a chamber, and includes a plurality of supports located in the chamber, a working fluid filled in the chamber, and at least one wick structure formed on inner wall surfaces of the chamber. The mounting elements are externally connected to one side of the ma…
- Who is the assignee on this patent?
- Wang Jui-Pin, Asia Vital Components Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification F28F3/12. Mapped technology areas include Mechanical Engineering.
- When was this patent published?
- Publication date Tue Mar 24 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).