Two-tier defect scan management
US-2024402922-A1 · Dec 5, 2024 · US
US8984367B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8984367-B2 |
| Application number | US-201113035826-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 25, 2011 |
| Priority date | Feb 25, 2011 |
| Publication date | Mar 17, 2015 |
| Grant date | Mar 17, 2015 |
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Integrated circuits with memory circuitry may include error detection circuitry and error correction circuitry. The error detection circuitry may be used to detect soft errors in the memory circuitry. The error detection circuitry may include logic gates that are used to perform parity checking. The error detection circuitry may have an interleaved structure to provide interleaved data bit processing, may have a tree structure to reduce logic gate delays, and may be pipelined to optimize performance. The memory circuitry may be loaded with interleaved parity check bits in conjunction with the interleaved structure to provide multi-bit error detection capability. The parity check bits may be precomputed using design tools or computed during device configuration. In response to detection of a memory error, the error correction circuitry may be used to scan desired portions of the memory circuitry and to correct the memory error.
Opening claim text (preview).
What is claimed is: 1. A method for operating an integrated circuit that includes a memory array comprising a plurality of memory elements and associated address lines and data lines, wherein a first set of memory elements in the memory array is coupled to a first address line and a second set of memory elements in the memory array is coupled to a second address line that is different from the first address line, the method comprising: detecting errors in the first and second sets…
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