Base, IC, and coupling interposer with boundary scan register

Patent metadata

Field	Value
Publication number	US-8984359-B2
Application number	US-201314023041-A
Country	US
Kind code	B2
Filing date	Sep 10, 2013
Priority date	Feb 7, 2011
Publication date	Mar 17, 2015
Grant date	Mar 17, 2015

Abstract

The disclosure describes a novel method and apparatus for improving interposers that connected stacked die assemblies to system substrates. The improvement includes the addition of IEEE 1149.1 circuitry within interposers to allow simplifying interconnect testing of digital and analog signal connections between the interposer and system substrate it is attached too. The improvement also includes the additional 1149.1 controlled circuitry that allows real time monitoring of voltage supply and ground buses in the interposer. The improvement also includes the additional of 1149.1 controlled circuitry that allows real time monitoring of functional digital and analog input and output signals in the interposer. The improvement also provides the ability to selectively serially link the 1149.1 circuitry in the interposer with 1149.1 circuitry in the die of the stack.

First claim

What is claimed is:

1. A device comprising:
A. a base substrate having functional input outputs, functional output inputs, a test data in output, a test mode select output, a test clock output, and a test data out input;
B. an integrated circuit die having functional inputs and functional outputs, and having no connection to any of the test data in output, the test mode select output, the test clock output, and the test data out input; and
C. an interposer, including:
i. firs…

Assignees

• Texas Instruments Inc

Inventors

• Whetsel Lee D

Classifications

• H10W70/63

  Electricity · mapped topic

• H10W72/884

  Electricity · mapped topic

• H10W90/754

  Electricity · mapped topic

• H10W90/732

  Electricity · mapped topic

• H10W90/724

  Electricity · mapped topic