Through-holed interposer, packaging substrate, and methods of fabricating the same

Patent metadata

Field	Value
Publication number	US-8981570-B2
Application number	US-201313845625-A
Country	US
Kind code	B2
Filing date	Mar 18, 2013
Priority date	Jul 26, 2012
Publication date	Mar 17, 2015
Grant date	Mar 17, 2015

Abstract

A through-holed interposer is provided, including a board body, a conductive gel formed in the board body, and a circuit redistribution structure disposed on the board body. The conductive gel has one end protruding from a surface of the board body, and an area of the protruded end of the conductive gel that is in contact with other structures (e.g., packaging substrates or circuit structures) is increased, thereby strengthening the bonding of the conductive gel and reliability of the interposer.

First claim

What is claimed is:

1. A through-holed interposer, comprising:
a board body having opposing first and second surfaces and a plurality of through holes connecting the first surface and the second surface;
a conductive gel formed in each of the through holes and having a first end protruded from the first surface of the board body; and
a circuit redistribution structure disposed on the second surface of the board body and a second end of the conductive gel and electrically connected to the second end of the conductive gel, wherein the circuit redistribution structure has a redistribution circuit layer that is in contact with the second end of the conductive gel, and the redistribution circuit layer is free from contacting the second surface of the board body.

2. The through-holed interposer of claim 1 , wherein the circuit redistribution structure further has at least a redistribution dielectric layer, and the redistribution circuit layer is formed on the redistribution dielectric layer and electrically connected to the second end of the conductive gel.

3. The through-holed interposer of claim 2 , wherein the circuit redistribution structure further has a plurality of redistribution conductive vias formed in the redistribution dielectric layer and electrically connected to the redistribution circuit layer.

4. The through-holed interposer of claim 1 , wherein the second end of the conductive gel protrudes from the second surface of the board body.

5. The through-holed interposer of claim 1 , further comprising another circuit redistribution structure disposed on the first surface of the board body and the first end of the conductive gel and electrically connected to the first end of the conductive gel.

6. The through-holed interposer of claim 5 , wherein the another circuit redistribution structure has at least a redistribution dielectric layer, and another redistribution circuit layer formed on the redistribution dielectric layer and electrically connected to the first end of the conductive gel.

7. The through-holed interposer of claim 6 , wherein the another circuit redistribution structure further has a plurality of redistribution conductive vias formed in the redistribution dielectric layer and electrically connected to the redistribution circuit layer and the first end of the conductive gel.

8. The through-holed interposer of claim 1 , further comprising a surface treatment layer formed on the first end of the conductive gel.

Assignees

• Unimicron Technology Corp

Inventors

• Tseng Tzyy-Jang
• Hu Dyi-Chung
• Chan Ying-Chih

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W72/252

  comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W70/685

  comprising multiple insulating layers · CPC title