Wiring board for electronic parts inspecting device and its manufacturing method

US8981237B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8981237-B2
Application numberUS-201213414317-A
CountryUS
Kind codeB2
Filing dateMar 7, 2012
Priority dateMar 7, 2011
Publication dateMar 17, 2015
Grant dateMar 17, 2015

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A wiring board for an electronic parts inspecting device that can be designed and produced relatively quickly, inexpensively, and with a few number of jigs is provided. In certain embodiments the wiring board comprises a board main body having a front surface, a probe pad area having probe pads located in a central portion of the front surface, an outer connecting terminal area having outer connecting terminals located in a peripheral portion of the front surface, and wherein probe pads are connected to outer connecting terminals by front surface wirings formed between the probe pad area and the outer connecting terminal area. While certain embodiments further comprise inner wirings and first via conductors to connect the probe pads and outer connecting terminals, it is preferable to have no or a minimal amount of such inner wirings. Lastly, a method of manufacturing the same is provided.

First claim

Opening claim text (preview).

What is claimed is: 1. A wiring board for an electronic parts inspecting device, comprising: a board main body having a front surface and a back surface, at least the front surface being formed with an insulating layer; a probe pad area, located in a central portion of the front surface of the board main body; a plurality of probe pads formed in the probe pad area, the probe pads configured such that probes can be attached thereto; and an outer connecting terminal area, in w…

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What does patent US8981237B2 cover?
A wiring board for an electronic parts inspecting device that can be designed and produced relatively quickly, inexpensively, and with a few number of jigs is provided. In certain embodiments the wiring board comprises a board main body having a front surface, a probe pad area having probe pads located in a central portion of the front surface, an outer connecting terminal area having outer con…
Who is the assignee on this patent?
Ono Tomoyoshi, Akita Kazushige, Nomura Toshihisa, and 1 more
What technology area does this patent fall under?
Primary CPC classification G01R31/50. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Mar 17 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).