Thermoplastic resin compositions, adhesive coating materials, and laminates using the same
US-11987692-B2 · May 21, 2024 · US
Adhesive composition
US8980997B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8980997-B2 |
| Application number | US-201113157568-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 10, 2011 |
| Priority date | Jun 15, 2010 |
| Publication date | Mar 17, 2015 |
| Grant date | Mar 17, 2015 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
Disclosed is an adhesive composition in which a solid component is dissolved in a solvent, the solid component being dissolved in the solvent to have a solid component content of not less than 20% by weight with respect to a total amount of the solid component and the solvent, the solid component containing resin obtained by polymerizing a monomer composition that contains a cycloolefin monomer, the solvent having no carbon-carbon double bond, and an alcohol content contained in the solvent being not more than 0.45% by weight with respect to an entire amount of the solvent.
First claim
Opening claim text (preview).
The invention claimed is: 1. An adhesive composition comprising a solid component dissolved in a solvent, wherein: the solvent is p-menthane, and the solid component dissolved in the solvent comprises a solid component content of not less than 20% by weight with respect to a total amount of the solid component and the solvent, the solid component comprises a resin obtained by polymerizing a monomer composition that contains a cycloolefin monomer, and the solvent comprises an a…
Assignees
Inventors
Classifications
- C09J123/0823Primary
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
- C09J145/00Primary
Chemistry & Metallurgy · mapped topic
Chemistry & Metallurgy · mapped topic
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US8980997B2 cover?
- Disclosed is an adhesive composition in which a solid component is dissolved in a solvent, the solid component being dissolved in the solvent to have a solid component content of not less than 20% by weight with respect to a total amount of the solid component and the solvent, the solid component containing resin obtained by polymerizing a monomer composition that contains a cycloolefin monomer…
- Who is the assignee on this patent?
- Tamura Koki, Asai Takahiro, Kubo Atsushi, and 3 more
- What technology area does this patent fall under?
- Primary CPC classification C09J123/0823. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Mar 17 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).