Stereolithography resin compositions and three-dimensional objects made therefrom

US8980971B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8980971-B2
Application numberUS-201313898801-A
CountryUS
Kind codeB2
Filing dateMay 21, 2013
Priority dateMar 20, 2007
Publication dateMar 17, 2015
Grant dateMar 17, 2015

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A photocurable resin composition for three-dimensional photofabrication operations, including stereolithography, comprising (A) a cationically polymerizable compound having two or more bisphenol structures and one or more hydroxyl groups, (B) a cationically polymerizable compound other than the component (A), (C) a cationic photoinitiator, (D) a radically polymerizable compound, (E) a radical photoinitiator, and (F) multilayer polymer particles having a core and a shell layer, the shell layer containing functional group-modified rubber polymer particles having at least one reactive functional group.

First claim

Opening claim text (preview).

The invention claimed is: 1. A photocurable resin composition for three-dimensional photofabrication comprising: (A) from about 3 to about 40% by mass of a cationically polymerizable compound having two or more bisphenol structures and one or more hydroxyl groups; (B) from about 20 to about 85% by mass of a cationically polymerizable compound other than the component (A); (C) from about 0.1 to about 10% by mass of a cationic photoinitiator; (D) from about 3 to about 45% by m…

Assignees

Inventors

Classifications

Patent family

Related publications grouped by family.

External sources

Next steps

Free tools are coming soon. Tell us what you want to track and we'll notify you.

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US8980971B2 cover?
A photocurable resin composition for three-dimensional photofabrication operations, including stereolithography, comprising (A) a cationically polymerizable compound having two or more bisphenol structures and one or more hydroxyl groups, (B) a cationically polymerizable compound other than the component (A), (C) a cationic photoinitiator, (D) a radically polymerizable compound, (E) a radical p…
Who is the assignee on this patent?
Dsm Ip Assets Bv, Jsr Corp, Japan Fine Coatings Co Ltd
What technology area does this patent fall under?
Primary CPC classification G03F7/0037. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Mar 17 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).