Optoelectronic component and method for producing same
US-12176444-B2 · Dec 24, 2024 · US
Method of fabricating chip scale package
US8980697B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8980697-B2 |
| Application number | US-201313766195-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 13, 2013 |
| Priority date | Mar 8, 2012 |
| Publication date | Mar 17, 2015 |
| Grant date | Mar 17, 2015 |
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Abstract
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A reconfigured wafer of resin-encapsulated semiconductor packages is obtained by supporting with a resin, thereafter, a grinding process is performed on top and backside surfaces to expose only a bump interconnection electrode on a surface of a semiconductor chip. Further, a chip-scale package is obtained by a dicing process along a periphery of the chip.
First claim
Opening claim text (preview).
What is claimed is: 1. A method of manufacturing a semiconductor device comprising: arranging and mounting a plurality of resin-encapsulated semiconductor packages on a surface of a substrate, each of the semiconductor packages being physically separated prior to the arranging, each of the semiconductor packages including a semiconductor chip encapsulated by a first resin, an I/O electrode formed on the semiconductor chip, and an interconnection electrode unit formed on the I/O el…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8980697B2 cover?
- A reconfigured wafer of resin-encapsulated semiconductor packages is obtained by supporting with a resin, thereafter, a grinding process is performed on top and backside surfaces to expose only a bump interconnection electrode on a surface of a semiconductor chip. Further, a chip-scale package is obtained by a dicing process along a periphery of the chip.
- Who is the assignee on this patent?
- Toshiba Kk
- What technology area does this patent fall under?
- Primary CPC classification H10W72/0198. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 17 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).