Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
Semiconductor device manufacturing method
US8980692B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8980692-B2 |
| Application number | US-201414156671-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 16, 2014 |
| Priority date | Aug 3, 2011 |
| Publication date | Mar 17, 2015 |
| Grant date | Mar 17, 2015 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A semiconductor device includes a circuit substrate, a first semiconductor chip disposed on the circuit substrate, a plurality of first spacers disposed on the first semiconductor chip, a second semiconductor chip which includes a first adhesive agent layer on a lower face thereof and is disposed on upper portions of the plurality of spacers, a wire which connects the circuit substrate to the first semiconductor chip, and a first sealing material which seals a gap between the first semiconductor chip and the first adhesive agent layer, wherein each height of the plurality of the first spacers is greater than height of the wire relative to an upper face of the first semiconductor chip.
First claim
Opening claim text (preview).
What is claimed is: 1. A semiconductor device manufacturing method comprising: mounting a second semiconductor chip including a first adhesive agent layer, which is thermoplastic and disposed on a lower face thereof, on a spacer directly adhered to an upper face of a first semiconductor chip disposed on a circuit substrate; and adhering the second semiconductor chip to the spacer after the mounting of the second semiconductor by pressing the second semiconductor chip mounted on…
Assignees
Inventors
Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US8980692B2 cover?
- A semiconductor device includes a circuit substrate, a first semiconductor chip disposed on the circuit substrate, a plurality of first spacers disposed on the first semiconductor chip, a second semiconductor chip which includes a first adhesive agent layer on a lower face thereof and is disposed on upper portions of the plurality of spacers, a wire which connects the circuit substrate to the f…
- Who is the assignee on this patent?
- Fujitsu Semiconductor Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10W90/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 17 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).