Light Emitting Diode Epitaxial Structure and Light Emitting Diode
US-2024297271-A1 · Sep 5, 2024 · US
US8980658B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8980658-B2 |
| Application number | US-201313755846-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 31, 2013 |
| Priority date | Feb 18, 2008 |
| Publication date | Mar 17, 2015 |
| Grant date | Mar 17, 2015 |
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A light-emitting element includes a n-type silicon oxide film and a p-type silicon nitride film. The n-type silicon oxide film and the p-type silicon nitride film formed on the n-type silicon oxide film form a p-n junction. The n-type silicon oxide film includes a plurality of quantum dots composed of n-type Si while the p-type silicon nitride film includes a plurality of quantum dots composed of p-type Si. Light emission occurs from the boundary between the n-type silicon oxide film and the p-type silicon nitride film by injecting electrons from the n-type silicon oxide film side and holes from the p-type silicon nitride film side.
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What is claimed is: 1. A method for manufacturing a light-emitting element, comprising: depositing a first insulator including quantum dots on a principal surface of a semiconductor substrate; depositing a second insulator including quantum dots on the first insulator; introducing a first impurity of a first conduction type into the first insulator; introducing a second impurity of a second conduction type into the second insulator, wherein the second conduction type is diff…
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