Pvt-method and device for producing single crystals in a safe manner with regard to the process
US-2024376633-A1 · Nov 14, 2024 · US
US8980445B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8980445-B2 |
| Application number | US-42895406-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 6, 2006 |
| Priority date | Jul 6, 2006 |
| Publication date | Mar 17, 2015 |
| Grant date | Mar 17, 2015 |
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A semiconductor crystal and associated growth method are disclosed. The crystal includes a seed portion and a growth portion on the seed portion. The seed portion and the growth portion form a substantially right cylindrical single crystal of silicon carbide. A seed face defines an interface between the growth portion and the seed portion, with the seed face being substantially parallel to the bases of the right cylindrical crystal and being off-axis with respect to a basal plane of the single crystal. The growth portion replicates the polytype of the seed portion and the growth portion has a diameter of at least about 100 mm.
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The invention claimed is: 1. An off-axis single crystal silicon carbide wafer made by a method of: cutting a seed crystal of silicon carbide from a bulk single crystal of silicon carbide at an angle with respect to the c-axis of the bulk crystal to produce a seed crystal with a seed face that is off-axis with respect to the c-face of the bulk crystal; applying a thermal gradient to the seed crystal in a seeded growth system in a direction that is perpendicular to the seed face o…
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