Fluid separation for an anodizing process
US-2024247392-A1 · Jul 25, 2024 · US
US8979995B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8979995-B2 |
| Application number | US-201013322811-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 26, 2010 |
| Priority date | May 29, 2009 |
| Publication date | Mar 17, 2015 |
| Grant date | Mar 17, 2015 |
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The invention relates to a suspension for producing a friction-increasing layer on a substrate, which comprises a liquid suspension medium, a predominantly inorganic binder or precursor compounds thereof and suspended hard material particles. The invention further relates to a shaped body comprising a substrate and a friction-increasing layer which has been applied to at least part of the surface of the substrate and comprises a predominantly inorganic binder matrix and hard material particles embedded therein, where the thickness of the binder matrix is less than the average particle size of the hard material particles so that the hard material particles project from the binder matrix and where the friction-increasing layer has been formed from a suspension according to the invention. The invention likewise relates to a process for producing the abovementioned shaped bodies and also their use for producing press or clamp connections and also as securing element.
Opening claim text (preview).
The invention claimed is: 1. A suspension for producing a friction-increasing layer on a substrate comprising: a liquid suspension medium, a predominantly inorganic SiO 2 -based binder or precursor compounds thereof, and suspended hard material particles selected from the group consisting of diamond, silicon carbide, and boron carbide, wherein the friction-increasing layer has a thickness less than an average particle size of the hard material particles so the hard material part…
Mechanical Engineering · mapped topic
Mechanical Engineering · mapped topic
Mechanical Engineering · mapped topic
Mechanical Engineering · mapped topic
Mechanical Engineering · mapped topic
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