Process for producing metallic components

US8979971B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8979971-B2
Application numberUS-201213465773-A
CountryUS
Kind codeB2
Filing dateMay 7, 2012
Priority dateMay 18, 2011
Publication dateMar 17, 2015
Grant dateMar 17, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A process for producing a metallic component with an opening or a hollow space by selective laser sintering or laser melting includes melting a metallic powder in layers at appropriate cross-sectional regions by using laser radiation. After the laser sintering or laser melting process, the component is subjected to a fracture splitting process, in which the component is fractured into at least two fractional parts along a fracture line and then the at least two fractional parts are connected to one another at the sites of fracture to form the component. The fracture line contacts or passes through the opening or the hollow space.

First claim

Opening claim text (preview).

What is claimed is: 1. A process for producing a metallic component with at least one of an opening and a hollow space, comprising: (a) melting single-component or multicomponent metallic powder by at least one of selective laser sintering and laser melting, wherein the single-component or multicomponent metallic powder is melted in layers at appropriate cross-sectional regions using laser radiation to produce the component; (b)(i) wherein during the step of melting a variation in the energy input per unit area into the powder material proceeding from the laser beam is effected within one powder layer or in different powder layers; or (b)(ii) after the powder has been melted for the first time but before a subsequent layer is applied, the laser beam further melts, heats, or removes the powder within a powder layer at at least one already solidified layer region; and (c) after the melting, subjecting the produced component to a fracture splitting process, in which the component is fractured into at least two fractional parts along a predetermined fracture line; and then (d) connecting the at least two fractional parts to one another at the sites of fracture thereof to form the component, wherein at least a certain region of the fracture line contacts or passes through the at least one of the opening and the hollow space. 2. The process of claim 1 , wherein the variation in the energy input per unit area, the further melting, the heating, or the removal by the laser beam is performed in the region of the fracture line. 3. The process of claim 1 , after the fracture splitting and before the fractional parts are connected to one another, the at least one of the opening and the hollow space: undergoes at least one of a thermal and mechanical aftertreatment at least in certain regions, is provided with a coating at least in certain regions, or receives or is attached to a body. 4. The process of claim 1 , wherein the component includes at least first and second component regions, wherein the first component region is produced by the at least one of selective laser sintering and laser melting and the second component region is produced by a conventional production process, in particular by a casting process or a chip-forming process, with the first and the second component regions being connected to one another. 5. The process of claim 4 , wherein the first component region is constructed directly on the second component region by the at least one of selective laser sintering and laser melting. 6. The process of claim 1 , forming, in the region of the fracture line, geometrically formed predetermined breaking points. 7. The process of claim 6 , wherein the predetermined breaking points are formed where at least one of complete and all-over melting of the powder is not effected. 8. The process of claim 1 , wherein, after the at least one of laser sintering and laser melting process, the component undergoes at least one of material removal and material weakening, which lies in the superficial region of the fracture line, by the superficial action of a laser or a chip-forming tool. 9. The process of claim 8 , the one of material removal and material weakening is effected using the laser from the at least one of laser sintering and laser melting. 10. A process for producing a metallic component, comprising: melting single-component or multicomponent metallic powder by at least one of selective laser sintering and laser melting, wherein the single-component or multicomponent metallic powder is melted in layers at appropriate cross-sectional regions using laser radiation to produce the component, after the melting, subjecting the produced component to a fracture splitting process, in which the component is fractured into at least two fractional parts along a predetermined fracture line; connecting the at least two fractional parts to one another at the sites of fracture thereof to form the component; and constructing a component region by a generative production process on at least one surface of at least one of the fractional parts after the fracture splitting and before the reconnection.

Assignees

Inventors

Classifications

  • B22F5/10Primary

    of articles with cavities or holes, not otherwise provided for in the preceding subgroups · CPC title

  • by mechanical means · CPC title

  • by thermal means (control of energy beam parameters for post heating B22F10/364) · CPC title

  • to achieve specific product aspects, e.g. surface smoothness, density, porosity or hollow structures · CPC title

  • for post-heating, e.g. remelting · CPC title

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What does patent US8979971B2 cover?
A process for producing a metallic component with an opening or a hollow space by selective laser sintering or laser melting includes melting a metallic powder in layers at appropriate cross-sectional regions by using laser radiation. After the laser sintering or laser melting process, the component is subjected to a fracture splitting process, in which the component is fractured into at least …
Who is the assignee on this patent?
Schuster Rainer, Man Truck & Bus Ag
What technology area does this patent fall under?
Primary CPC classification B22F5/10. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Mar 17 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).