Cable assembly having a wire management with an electroplated layer

Patent metadata

Field	Value
Publication number	US-8979587-B2
Application number	US-201314017330-A
Country	US
Kind code	B2
Filing date	Sep 4, 2013
Priority date	Sep 4, 2012
Publication date	Mar 17, 2015
Grant date	Mar 17, 2015

Abstract

A cable assembly comprises an insulative housing; a plurality of terminals received into the insulative housing; a cable electrically connected to the plurality of terminals. The cable comprises two differential pairs of signal wires. Each differential pair of signal wires comprises two signal wires, a grounding wire and a shielding layer surrounding the two signal wires and a grounding wire. Front end regions of the signal wires and the grounding wires are exposed out of the shielding layer. And, a wire management is assembled to a rear end of the insulative housing and defines a plurality of channels respectively plated with an electroplated layer. The front end regions of the signal wires and the grounding wires are respectively passed through the plurality of channels and electrically connected to the corresponding terminals.

First claim

What is claimed is:

1. A cable assembly comprising:
an insulative housing;
a plurality of terminals received into the insulative housing;
a cable electrically connected to the plurality of terminals, the cable comprising two differential pairs of signal wires, each differential pair of signal wires comprising two signal wires, a grounding wire and a shielding layer surrounding the two signal wires and a grounding wire, front end regions of the signal wires and the grounding wi…

Assignees

• Hon Hai Prec Ind Co Ltd

Inventors

• Wu Jerry
• Chen Jun
• Song zhan-feng

Classifications

• H01R43/20

  Electricity · mapped topic

• H01R12/598 Primary

  Electricity · mapped topic

• H01R13/6599

  Electricity · mapped topic

• H01R13/6593 Primary

  Electricity · mapped topic

• Y10T29/49174

  Cross-Sectional Technologies · mapped topic