Photonic device and method of making same
US-11892678-B2 · Feb 6, 2024 · US
Circuit board and manufacturing method thereof and electro-optic apparatus having the circuit board
US8979372B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8979372-B2 |
| Application number | US-201313776737-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 26, 2013 |
| Priority date | Nov 1, 2012 |
| Publication date | Mar 17, 2015 |
| Grant date | Mar 17, 2015 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A circuit board, a manufacturing method thereof, and an electro-optic apparatus having the circuit board are provided. The circuit board includes a substrate including a first dielectric layer and a first circuit layer disposed thereon, a waveguide layer disposed on a portion of the substrate, a second dielectric layer, a convex structure and a second circuit layer. The second dielectric layer is disposed on the substrate and the waveguide layer. The second dielectric layer has an opening exposing the sidewall of the waveguide layer and a portion of the first circuit layer. The convex structure is disposed on the sidewall of the waveguide layer. The convex structure and the waveguide layer respectively have refractive index n 1 and n 2 , and |n 1 −n 2 |/n 1 <1%. The surface roughness of the convex structure is less than that of the sidewall of the waveguide layer. The second circuit layer is disposed on the second dielectric layer.
First claim
Opening claim text (preview).
What is claimed is: 1. A circuit board, comprising: a substrate comprising a first dielectric layer and a first circuit layer disposed on the first dielectric layer; a waveguide layer, disposed on a portion of the substrate; a second dielectric layer, disposed on the substrate and covers the waveguide layer, wherein the second dielectric layer has an opening exposing the sidewall of the waveguide layer and a portion of the first circuit layer; two convex structures, respecti…
Assignees
Inventors
Classifications
- G02B6/12Primary
Physics · mapped topic
Electricity · mapped topic
- H05K1/0274Primary
Electricity · mapped topic
Cross-Sectional Technologies · mapped topic
Physics · mapped topic
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US8979372B2 cover?
- A circuit board, a manufacturing method thereof, and an electro-optic apparatus having the circuit board are provided. The circuit board includes a substrate including a first dielectric layer and a first circuit layer disposed thereon, a waveguide layer disposed on a portion of the substrate, a second dielectric layer, a convex structure and a second circuit layer. The second dielectric layer …
- Who is the assignee on this patent?
- Unimicron Technology Corp
- What technology area does this patent fall under?
- Primary CPC classification G02B6/12. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Mar 17 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).