Flip chip assembly apparatus employing a warpage-suppressor assembly

Patent metadata

Field	Value
Publication number	US-8978960-B2
Application number	US-201414149272-A
Country	US
Kind code	B2
Filing date	Jan 7, 2014
Priority date	May 3, 2012
Publication date	Mar 17, 2015
Grant date	Mar 17, 2015

Abstract

A flip chip assembly apparatus includes at least one warpage-suppressor assembly. Each warpage-suppressor assembly can include a side heater, a deformable material pad, and an actuator assembly for moving the side heater and the deformable material pad. Each side heater provides additional heat to peripheral solder balls during bonding of two substrates, thereby facilitating the reflow of the peripheral solder balls. Each deformable material pad contacts, and presses down on, a surface of one of the two substrates under bonding. The deformable material pad(s) can prevent or minimize warpage of the contacted substrate.

First claim

What is claimed is:

1. A method of bonding substrates comprising:
providing a bonding apparatus including a bonder head, a base plate, and at least one warpage-suppressor assembly, wherein each of said at least one warpage-suppressor assembly comprises a deformable material pad, an actuator assembly, and further comprises a side heater;
attaching a first substrate to said bonder head, said bonder head holding said first substrate upside down;
attaching a second substrate to sa…

Assignees

• IBM

Inventors

• Brofman Peter J
• Nah Jae-Woong
• Sakuma Katsuyuki

Classifications

• H10W72/072

  Electricity · mapped topic

• B23K37/04

  Operations & Transport · mapped topic

• B23K1/0016 Primary

  Operations & Transport · mapped topic

• B23K35/0222

  Operations & Transport · mapped topic

• B23K3/047

  Operations & Transport · mapped topic