Integrated electronic device for detecting a local parameter related to a force experienced in a predetermined direction, within a solid structure

Patent metadata

Field	Value
Publication number	US-8978483-B2
Application number	US-201314108688-A
Country	US
Kind code	B2
Filing date	Dec 17, 2013
Priority date	Dec 27, 2012
Publication date	Mar 17, 2015
Grant date	Mar 17, 2015

Abstract

The integrated electronic device is for detecting a local parameter related to a force experienced in a predetermined direction within a solid structure. The device includes a semiconductor substrate having a substantially planar region that defines a plane substantially perpendicular to the predetermined direction. At least one sensor detects the local parameter at least in the predetermined direction with a piezo-resistive effect. At least one substantially planar face is arranged in a portion of the integrated electronic device, the face belonging to a inclined plane by a predetermined angle relative to the plane perpendicular to the predetermined direction, which plane is defined by the substantially planar region of the substrate. The predetermined angle is defined such as to reduce forces acting in directions other than the predetermined direction at the portion of the device around the at least one sensor.

First claim

That which is claimed:

1. An integrated electronic device for detecting a local parameter related to a force experienced in a given direction, within a solid structure, the device comprising:
a substrate comprising a semiconductor material having a substantially planar region configured to define a plane substantially perpendicular to the given direction;
at least one sensor, arranged at the substantially planar region of the substrate, and configured to detect the local parameter at least in the given direction with a piezo-resistive effect;
at least one substantially planar face configured in a portion of the integrated electronic device around the at least one sensor, the at least one face belonging to an inclined plane by an angle relative to the plane substantially perpendicular to the given direction, which plane is defined by the substantially planar region of the substrate;
the angle being defined such as to reduce on the at least one sensor the effect of forces acting in directions other than the given direction at the portion of the device around the at least one sensor.

2. The integrated electronic device according to claim 1 , wherein the at least one substantially planar face is continuously distributed along a perimeter defined by the portion of the device around the at least one sensor.

3. The integrated electronic device according to claim 1 , further comprising a plurality of faces, separated from each other, and each extending along a side of a perimeter defined by the portion of the device around the at least one sensor.

4. The integrated electronic device according to claim 1 , further comprising at least one additional substantially planar face arranged in an additional portion of the integrated electronic device around the at least one sensor, which is opposite to the portion, said at least one additional face belonging to a inclined plane of an additional angle relative to the plane perpendicular to the given direction which plane is defined by the substantially planar region of the substrate, the additional angle being defined such as to reduce forces acting in directions other than the given direction at the additional portion of the device.

5. The integrated electronic device according to claim 4 , wherein the at least one additional substantially planar face arranged in the additional portion of the device is continuously distributed along a perimeter defined by the portion of the device.

6. The integrated electronic device according to claim 4 , further comprising a plurality of additional faces, separated from each other, and each extending along a side of a perimeter defined by the additional portion of the device.

7. The integrated electronic device according to claim 4 , wherein the at least one face and the at least one additional face, along a sectional plane of the device, are joined to each other at a point.

8. The integrated electronic device according to claim 4 , wherein the at least one face and the at least one additional face, along a sectional plane of the device, are joined to each other via a junction plane.

9. The integrated electronic device according to claim 1 , wherein the at least one sensor further comprises an additional sensor configured to detect the local parameter at least in the given direction with a piezo-resistive effect, the at least one additional sensor being arranged at the substantially planar region of the substrate.

10. The integrated electronic device according to claim 9 , wherein the at least one sensor and the additional sensor are arranged, relative to the substantially planar region, substantially at the same distance from a center of the device, each proximate to a peripheral edge of the device.

11. The integrated electronic device according to claim 1 , further comprising operational circuitry within the substrate, a portion of the operational circuitry defining the at least one sensor.

12. The integrated electronic device according to claim 11 , wherein the portion of the device is within the substrate, the device further comprising:
an additional substrate of a semiconductor material arranged on the operational circuitry;
at least one additional substantially planar face arranged in another portion of the device around the at least one sensor, the another portion of the device being in the additional substrate, the at least one additional face belonging to another inclined plane of an angle relative to the plane perpendicular to the given direction which plane is defined by the substantially planar region of the substrate;
the angle being defined such as to reduce on the at least one sensor the effect of forces acting in directions other than the given direction at the another portion of the additional substrate of the device around the at least one sensor.

13. The integrated electronic device according to claim 12 , further comprising at least one damping element arranged to cover the substrate and the integrated operational circuitry, the at least one damping element comprising an elastic material and being configured to dampen forces acting in directions substantially perpendicular to the given direction.

14. A detection and monitoring module comprising:
at least one integrated electronic device for detecting a local parameter related to a force experienced in a given direction, within a solid structure, the device comprising
a substrate comprising a semiconductor material having a substantially planar region configured to define a plane substantially perpendicular to the given direction,
a sensor, arranged at the substantially planar region of the substrate, and configured to detect the local parameter at least in the given direction with a piezo-resistive effect,
an integrated antenna coupled to the sensor;
at least one substantially planar face configured in a portion of the integrated electronic device around the sensor, the at least one face belonging to an inclined plane by an angle relative to the plane substantially perpendicular to the given direction, which plane is defined by the substantially planar region of the substrate,
the angle being defined such as to reduce on the sensor the effect of forces acting in directions other than the given direction at the portion of the device around the sensor; and
an integrated electromagnetic unit configured to communicate signals for telecommunications and energy exchange between the integrated antenna of the device and a remote antenna, the electromagnetic unit being integral with the integrated electronic device;
the integrated antenna, the electromagnetic unit and the remote antenna being operatively connected through wireless coupling in a wireless mode.

15. The detection and monitoring module according to claim 14 , wherein the at least one integrated electronic device comprises a plurality of integrated electronic detection devices each comprising a respective sensor, wherein at least one sensor is configured to detect the component of the force acting in the given direction and another of the sensors is configured to detect the component of the force acting in a direction other than the given direction.

16. The detection and monitoring module according to claim 14 , wherein, in the integrated electronic device, the at least one substantially planar face is continuously distributed along a perimeter defined by the portion of the device around the sensor.

17. The detection and monitoring module according to claim 14 , wherein the integrated electronic device further comprises a plurality of faces, separated from each other, and each exte

Assignees

• Stmicroeletronics S R L
• St Microelectronics Srl

Inventors

• Pagani Alberto
• Ziglioli Federico Giovanni
• Murari Bruno

Classifications

• G01L1/26

  Auxiliary measures taken, or devices used, in connection with the measurement of force, e.g. for preventing influence of transverse components of force, for preventing overload · CPC title

• G01B7/18

  using change in resistance · CPC title

• G01M5/0041

  by determining deflection or stress · CPC title

• G01L1/18 Primary

  using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material · CPC title

• G01M5/0083

  by measuring variation of impedance, e.g. resistance, capacitance, induction · CPC title