Subassembly for a vehicle, and vehicle
US-12510381-B2 · Dec 30, 2025 · US
Position measuring system and method for assembly
US8978441B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8978441-B2 |
| Application number | US-201113135223-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 29, 2011 |
| Priority date | Jul 5, 2010 |
| Publication date | Mar 17, 2015 |
| Grant date | Mar 17, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
A method for mounting a substrate of a measurement graduation and a scanning head of a position measuring system on a first machine part and a second machine part. The method including fastening a substrate of a measurement graduation and a scanning head on first and second portions, respectively, of a mounting aid. The method including adjusting a location of the first portion relative to the second portion in a first degree of freedom that differs from a measurement direction in which a relative position of the first machine part relative to the second machine part is to be measured. The method including fastening the substrate and the scanning head on the first and second machine parts, respectively, at the mounting position. The method further including removing the mounting aid.
First claim
Opening claim text (preview).
We claim: 1. A position measuring system for measuring a relative position of a first machine part relative to a second machine part in a measurement direction, the position measurement system comprising: a substrate of a measurement graduation, wherein said substrate is mountable on a first machine part; a scanning head for scanning said measurement graduation, wherein said scanning head is mountable on a second machine part that moves relative to said first machine part in a m…
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- G01D5/24423Primary
Physics · mapped topic
Physics · mapped topic
Physics · mapped topic
Physics · mapped topic
Cross-Sectional Technologies · mapped topic
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Frequently asked questions
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- What does patent US8978441B2 cover?
- A method for mounting a substrate of a measurement graduation and a scanning head of a position measuring system on a first machine part and a second machine part. The method including fastening a substrate of a measurement graduation and a scanning head on first and second portions, respectively, of a mounting aid. The method including adjusting a location of the first portion relative to the …
- Who is the assignee on this patent?
- Pucher Wolfgang, Kühler Markus, Heidenhain Gmbh Dr Johannes
- What technology area does this patent fall under?
- Primary CPC classification G01D5/24423. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Mar 17 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).