Storage device and method for producing the same

US8976533B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-8976533-B2
Application numberUS-201113315288-A
CountryUS
Kind codeB2
Filing dateDec 9, 2011
Priority dateNov 1, 2011
Publication dateMar 10, 2015
Grant dateMar 10, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A storage device including a circuit board, an electronic device package and a terminal module is provided. The circuit board has a first surface and a second surface opposite to each other, a plurality of via-holes connecting the first surface and the second surface, a plurality of first pads on the first surface, and a plurality of first pads on the second surface. The electronic device package is disposed on the first surface. The terminal module disposed on the first surface has a plurality of first and second contact parts, and each of the first contact parts passes through the corresponding via-hole and is protruded out of the second surface, and each of the second contact parts is electrically connected to the corresponding first pad. An orthogonal projection area of the electronic device package on the first surface is smaller than an area of the first surface.

First claim

Opening claim text (preview).

What is claimed is: 1. A storage device, comprising: a circuit board, having a first surface and a second surface opposite to each other, a connection end and another end opposite to each other, a plurality of via-holes connecting the first surface and the second surface, a plurality of first metal pads on the first surface and disposed between the via-holes and the connection end, and a plurality of second metal pads on the second surface; an electronic device package, disposed…

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What does patent US8976533B2 cover?
A storage device including a circuit board, an electronic device package and a terminal module is provided. The circuit board has a first surface and a second surface opposite to each other, a plurality of via-holes connecting the first surface and the second surface, a plurality of first pads on the first surface, and a plurality of first pads on the second surface. The electronic device packa…
Who is the assignee on this patent?
Lin Wei-Hung, Chung Hung-I, Phison Electronics Corp
What technology area does this patent fall under?
Primary CPC classification G06F1/16. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Mar 10 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).