Force and heat spreading PCB for LCD protection and interconnection

Patent metadata

Field	Value
Publication number	US-8976527-B2
Application number	US-201213631973-A
Country	US
Kind code	B2
Filing date	Sep 29, 2012
Priority date	Sep 29, 2012
Publication date	Mar 10, 2015
Grant date	Mar 10, 2015

Abstract

The described embodiment relates generally to the manufacture of display assemblies. More particularly the use of alternative back plates for a display assembly is discussed. By using a printed circuit board (PCB) in lieu of a metal backer heat can be evenly spread across the backer by applying a layer of copper configured to normalize a spread of heat across the printed circuit board. The configuration of the copper layer can be configured based on a tested or simulated heat map that accounts for proximate heat producing elements. The PCB can also advantageously act as an interconnection layer between other electrical components disposed within the electronic device.

First claim

What is claimed is:

1. An electronic device, comprising:
a device housing;
a display panel; and
an integrated support member substantially parallel to the display panel, the integrated support member comprising:
a glass reinforced epoxy laminate substrate,
a plurality of electrical components surface mounted to a first surface of the glass reinforced epoxy laminate substrate,
a plurality of metallic fingers configured to dissipate heat across the first surface of the glas…

Assignees

• Apple Inc

Inventors

• Gibbs Kevin D
• Qian Amy
• Raff John
• Wright Derek

Classifications

• H05K2201/10106

  Electricity · mapped topic

• H05K2201/10128

  Electricity · mapped topic

• H05K2201/09681

  Electricity · mapped topic

• H05K2201/09781

  Electricity · mapped topic

• Y10T29/4913

  Cross-Sectional Technologies · mapped topic