Operating a metrology system, lithographic apparatus, and methods thereof
US-2024134289-A1 · Apr 25, 2024 · US
Method of applying a pattern to a substrate, device manufacturing method and lithographic apparatus for use in such methods
US8976355B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8976355-B2 |
| Application number | US-201213597806-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 29, 2012 |
| Priority date | Sep 28, 2011 |
| Publication date | Mar 10, 2015 |
| Grant date | Mar 10, 2015 |
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Abstract
Official abstract text for this publication.
A substrate is loaded onto a substrate support of a lithographic apparatus, after which the apparatus measures locations of substrate alignment marks. These measurements define first correction information allowing the apparatus to apply a pattern at one or more desired locations on the substrate. Additional second correction information is used to enhance accuracy of pattern positioning, in particular to correct higher order distortions of a nominal alignment grid. The second correction information may be based on measurements of locations of alignment marks made when applying a previous pattern to the same substrate. The second correction information may alternatively or in addition be based on measurements made on similar substrates that have been patterned prior to the current substrate.
First claim
Opening claim text (preview).
The invention claimed is: 1. A lithographic apparatus configured to transfer a pattern from a patterning device onto a substrate, the lithographic apparatus comprising: a patterning subsystem configured to apply the pattern from the patterning device to a portion of the substrate held at a patterning location; a substrate support configured to hold the substrate while the pattern is applied; a measurement subsystem configured to measure locations of a first set of alignment ma…
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Physics · mapped topic
- G03F7/70616Primary
Physics · mapped topic
- G03F7/70141Primary
Physics · mapped topic
Physics · mapped topic
Physics · mapped topic
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Frequently asked questions
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- What does patent US8976355B2 cover?
- A substrate is loaded onto a substrate support of a lithographic apparatus, after which the apparatus measures locations of substrate alignment marks. These measurements define first correction information allowing the apparatus to apply a pattern at one or more desired locations on the substrate. Additional second correction information is used to enhance accuracy of pattern positioning, in pa…
- Who is the assignee on this patent?
- Van Der Sanden Stefan Cornelis Theodorus, Van Haren Richard Johannes Franciscus, Simons Hubertus Johannes Gertrudus, and 5 more
- What technology area does this patent fall under?
- Primary CPC classification G03F7/70616. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Mar 10 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).