Radio frequency module
US-2024304973-A1 · Sep 12, 2024 · US
Transmission line having band-shaped resistors connected to outer sides of ground electrodes in the transmission line
US8975987B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8975987-B2 |
| Application number | US-201214122900-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 31, 2012 |
| Priority date | May 31, 2011 |
| Publication date | Mar 10, 2015 |
| Grant date | Mar 10, 2015 |
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Abstract
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Provided is a transmission line used to transmit high-frequency electrical signals which can remove a dip-shaped (S 21 ) loss of transmission characteristics due to wall surface resonance, furthermore, can further decrease the size, and can suppress the manufacturing cost at a low level. The transmission line used to transmit high-frequency electrical signals ( 1 ) is made up of a signal line ( 3 ) used to transmit high-frequency electrical signals which is formed on a front surface ( 2 a ) of a dielectric substrate ( 2 ), GND electrodes ( 4 ) formed outside the signal line ( 3 ) and in vicinities of end portions of the front surface ( 2 a ), a GND electrode ( 6 ) that is electrically connected to the GND electrodes ( 4 ) through via holes ( 5 ) formed across an entire rear surface ( 2 b ) of the dielectric substrate ( 2 ), and band-shaped resistors ( 7 ) that are formed outside the GND electrodes ( 4 ) and in the end portions of the surface ( 2 a ) and are electrically connected to the GND electrodes ( 4 ).
First claim
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We claim: 1. A transmission line used to transmit high-frequency electrical signals, comprising: a signal line used to transmit high-frequency electrical signals therethrough; a pair of first ground electrodes formed on one principal surface of a dielectric substrate, each of said pair of first ground electrodes comprising an inner side facing the signal line and an outer side; a second ground electrode formed on the other principal surface of the dielectric substrate, that is…
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Frequently asked questions
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- What does patent US8975987B2 cover?
- Provided is a transmission line used to transmit high-frequency electrical signals which can remove a dip-shaped (S 21 ) loss of transmission characteristics due to wall surface resonance, furthermore, can further decrease the size, and can suppress the manufacturing cost at a low level. The transmission line used to transmit high-frequency electrical signals ( 1 ) is made up of a signal line (…
- Who is the assignee on this patent?
- Kinpara Yuhki, Kataoka Toshio, Takada Toru, and 2 more
- What technology area does this patent fall under?
- Primary CPC classification H01P3/081. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 10 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).