Semiconductor device reducing risks of a wire short-circuit and a wire flow

Patent metadata

Field	Value
Publication number	US-8975760-B2
Application number	US-201213561793-A
Country	US
Kind code	B2
Filing date	Jul 30, 2012
Priority date	Aug 10, 2011
Publication date	Mar 10, 2015
Grant date	Mar 10, 2015

Abstract

A semiconductor device includes a wiring substrate having first and second connection pads on a main surface thereof, a first semiconductor chip having first electrode pads, a second semiconductor chip having second electrode pads each of which has a size smaller than that of each of the first electrode pads, first wires connecting the first electrode pads with the first connection pads, and second wires connecting the second electrode pads with the second connection pads. The second wires have wide width parts at first ends. The first electrode pads are larger than the wide width parts while the second electrode pads are smaller than the wide width parts. The wide width parts are connected the second connection pads and the second wires have second ends connected to the second electrode pads via bump electrodes which are smaller than the second electrode pads.

First claim

What is claimed is:

1. A semiconductor device comprising:
a wiring substrate having a main surface, the wiring substrate including a plurality of first connection pads and a plurality of second connection pads which are formed on the main surface;
a first semiconductor chip mounted over the main surface of the wiring substrate, the first semiconductor chip including a plurality of first electrode pads;
a second semiconductor chip mounted over the main surface of the wiring sub…

Assignees

• Fujiwara Shori
• Ps4 Luxco Sarl

Inventors

• Fujiwara Shori

Classifications

• H10W90/754

  Electricity · mapped topic

• H10W90/752

  Electricity · mapped topic

• H10W90/734

  Electricity · mapped topic

• H10W90/732

  Electricity · mapped topic

• H10W90/24

  Electricity · mapped topic