Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
Semiconductor package having interposer with openings containing conductive layer
US8975758B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8975758-B2 |
| Application number | US-201113337197-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 26, 2011 |
| Priority date | Sep 20, 2011 |
| Publication date | Mar 10, 2015 |
| Grant date | Mar 10, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
A semiconductor package includes a first structural body having a first surface and a second surface which faces away from the first surface, and formed with first connection members on the first surface; a second structural body placed over the first structural body, and formed with second connection members on a surface thereof which faces the first surface of the first structural body; and an interposer interposed between the first structural body and the second structural body, and having a body which is formed with openings into which the first connection members and the second connection members are inserted and a conductive layer which is formed to fill the openings.
First claim
Opening claim text (preview).
What is claimed is: 1. A semiconductor package comprising: a first structural body having a first surface and a second surface which faces away from the first surface, and formed with first connection members on the first surface; a second structural body placed over the first structural body, and formed with second connection members on a surface which faces the first surface of the first structural body; an interposer interposed between the first structural body and the seco…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8975758B2 cover?
- A semiconductor package includes a first structural body having a first surface and a second surface which faces away from the first surface, and formed with first connection members on the first surface; a second structural body placed over the first structural body, and formed with second connection members on a surface thereof which faces the first surface of the first structural body; and a…
- Who is the assignee on this patent?
- Lee Seung Hyun, Sk Hynix Inc
- What technology area does this patent fall under?
- Primary CPC classification H10W90/701. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 10 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).