Semiconductor device
US-2024421048-A1 · Dec 19, 2024 · US
Multiple access over proximity communication
US8975752B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8975752-B2 |
| Application number | US-97149208-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 9, 2008 |
| Priority date | Jan 9, 2008 |
| Publication date | Mar 10, 2015 |
| Grant date | Mar 10, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
A multiple access Proximity Communication system in which electrical elements on an integrated circuit chip provide the multiplexing of multiple signals to a single electrical receiving element on another chip. Multiple pads formed on one chip and receiving separate signals may be capacitively coupled to one large pad on the other chip. Multiple inductive coils on one chip may be magnetically coupled to one large coil on another chip or inductive coils on three or more chips may be used for either transmitting or receiving. The multiplexing may be based on time, frequency, or code.
First claim
Opening claim text (preview).
What is claimed is: 1. An inter-substrate communication system, comprising: a plurality of substrates arranged together in a stack; on at least a first one of the substrates, a plurality of electrical transmitting elements, wherein each of the transmitting elements transmits a signal in a corresponding separate channel from a set of channels during a different assigned time slot in a set of time slots, wherein each transmitting element is active in its assigned time slot and is…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8975752B2 cover?
- A multiple access Proximity Communication system in which electrical elements on an integrated circuit chip provide the multiplexing of multiple signals to a single electrical receiving element on another chip. Multiple pads formed on one chip and receiving separate signals may be capacitively coupled to one large pad on the other chip. Multiple inductive coils on one chip may be magnetically c…
- Who is the assignee on this patent?
- Chow Alex, Hopkins R David, Drost Robert J, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification H10W72/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 10 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).