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Wiring material and semiconductor module using the same
US8975747B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8975747-B2 |
| Application number | US-201214238376-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 13, 2012 |
| Priority date | Sep 30, 2011 |
| Publication date | Mar 10, 2015 |
| Grant date | Mar 10, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
There is provided a wiring material including a core layer made of metal and a clad layer made of metal and a fiber in which the core layer is copper or an alloy containing copper and the clad layer is formed of copper or the alloy containing copper and the fiber having a thermal expansion coefficient lower than that of copper, the wiring material having a stacked structure in which at least one surface of the core layer is closely adhered to the clad layer, and the fiber in the clad layer is arranged so as to be parallel to the surface of the core layer.
First claim
Opening claim text (preview).
The invention claimed is: 1. A wiring material, comprising: a core layer made of metal; and a clad layer made of metal and a fiber, wherein the core layer is copper or an alloy containing copper, the clad layer is formed of copper or the alloy containing copper and the fiber having a thermal expansion coefficient lower than a thermal expansion coefficient of copper, the wiring material has a stacked structure in which at least one surface of the core layer is closely adher…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8975747B2 cover?
- There is provided a wiring material including a core layer made of metal and a clad layer made of metal and a fiber in which the core layer is copper or an alloy containing copper and the clad layer is formed of copper or the alloy containing copper and the fiber having a thermal expansion coefficient lower than that of copper, the wiring material having a stacked structure in which at least on…
- Who is the assignee on this patent?
- Ando Takashi, Kajiwara Ryoichi, Hozoji Hiroshi, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification H10W70/66. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 10 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).